XZZ Motherboard Layered Test Fixture for iPhone 11 Series

An iPhone 11 board that has been separated for repair can't be tested as a whole until it's soldered back together, unless you have a fixture that reconnects the layers temporarily. This XZZ fixture does that for the iPhone 11 family.

This layered test fixture from XZZ (Xinzhizao) is listed for the iPhone 11, 11 Pro and 11 Pro Max motherboards. It's built from flame-retardant, high-temperature and corrosion-resistant material with customized gold-plated spring-loaded probes.

When the fixture saves time

• A no-boot iPhone 11 where the fault could be on either layer.

• Checking a repaired layer before rejoining the sandwich.

• Verifying a donor layer before a board swap.

• Training on sandwich-board diagnosis without soldering.

Practical notes

The fixture measures 81.5 × 59 × 16 mm and weighs about 87 g, the most compact of the XZZ fixtures we list. Make sure the interposer pads are clean and flat before seating a layer, or the probes won't contact every point.

Press the board down evenly and never twist it on the probes. If a reading looks wrong, reseat the board before suspecting a fault; a single missed contact can mimic a dead line.