iPhone 17 Pro CNC Donor Board

On the iPhone 17 Pro, a board failure that reaches the inner layers can't be solved by swapping a single part. This CNC-machined donor board for the 17 Pro provides a fresh PCB onto which the customer's needed chips can be moved.

Available as an upper layer without NAND, or as a lower layer in US or EU versions. It is a donor PCB for reconstruction and data recovery only.

Faults it can address

• Shorts buried between layers.

• Broken vias found during diode testing.

• Damage left by an earlier failed reball.

• A phone that shows no sign of life.

Careful transfer work

Before separating anything, measure and log diode values on the customer's board so you can compare them later. Choose the lower layer region that matches the phone.

Use low, even heat and work under a microscope. Rejoin the halves, monitor current on a bench supply and confirm Face ID, cameras and charging. Keep the old board until the customer has approved the result. Write down which parts were transferred and any measurements that looked unusual, since that record makes follow-up work on this phone much simpler for whoever handles it next.