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iPhone 13 Pro CNC Donor Board, Upper Layer (Without NAND)

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Part

iPhone 13 Pro CNC Donor Board

Apple · SKU IP91028 · Fits 1 model

$13.46

per unit
Option
Volume pricing
QuantityUnit priceSaving
$13.46
$12.79−5%
$12.11−10%

Selected SKU IP91028

Shipping weight 0.05 kg

Compatible with 1 model

Match the model number printed on the device (Settings → About, or on the back) before ordering.

Details

Imagine an iPhone 13 Pro after a washing machine cycle, with corrosion through several board layers, no backup and photos that matter more than the phone. In cases like this, rebuilding on a donor PCB can be the only realistic route to the data. This CNC-machined board for the 13 Pro is made for that job.

Choose the upper layer without NAND, or a lower layer in a US or EU version. It's a component for reconstruction rather than a complete board.

When recovery calls for a donor PCB

  • Corrosion that has spread through internal layers.

  • Traces that can't be followed or bridged.

  • A board that won't power on after cleaning.

  • Data that must come off with no backup.

Protecting the customer's data

The customer's own chips are irreplaceable here, so handle them with care through every step and keep them away from excess heat. Map each transfer on the board view first.

Once the transplant is complete, rejoin the board and test it on a bench supply. Recover the data first, before any further repair attempts.

Specifications

ConditionNew
Part typeCNC donor board (PCB)
Compatible devicesiPhone 13 Pro
OptionsUpper layer (without NAND), lower layer US version, lower layer EU version

Questions

Is it for data recovery?

Yes, that's one of its main uses.

Does it include NAND?

The upper layer is supplied without NAND.

Is it a complete motherboard?

No.

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