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iPhone 14 CNC Donor Board, Upper Layer (Without NAND)

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Part

iPhone 14 CNC Donor Board

Apple · SKU IP91034 · Fits 1 model

$12.24

per unit
Option
Volume pricing
QuantityUnit priceSaving
$12.24
$11.63−5%
$11.02−10%

Selected SKU IP91034

Shipping weight 0.05 kg

Compatible with 1 model

Match the model number printed on the device (Settings → About, or on the back) before ordering.

Details

Pulling apart an iPhone 14 sandwich board that has already been reworked badly can tear pads off the interposer side, and sometimes there's not enough left to rebuild. This CNC-machined donor board for the iPhone 14 gives you a fresh PCB to work from.

It comes as an upper layer without NAND, or as a lower layer in a US or EU version. It's a donor board for reconstruction, not a finished motherboard.

Damage it can get you past

  • Pads torn during a failed board separation.

  • Burnt areas from a shorted rail.

  • Corroded vias after liquid.

  • A layer cracked by a hard drop.

How to approach an iPhone 14 rebuild

List every part that has to move across before you heat anything, starting with the chips tied to the customer's data. Use a microscope, a preheater and a controlled hot air setup, and keep the separated halves supported so they don't warp.

Pick the lower-layer region to match the phone you're repairing. After the transfer, rejoin the halves, check the boot current on a bench supply and confirm basic functions before fitting the board back in the housing.

Specifications

ConditionNew
Part typeCNC donor board (PCB)
Compatible devicesiPhone 14
OptionsUpper layer (without NAND), lower layer US version, lower layer EU version

Questions

Does the upper layer include NAND?

No, it's supplied without NAND.

Is it a full motherboard?

No, it's a donor PCB.

Which lower layers are offered?

US and EU versions.

More parts for iPhone 14

All iPhone 14 parts →

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