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iPhone 13 CNC Donor Board, Upper Layer (Without NAND)

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Part

iPhone 13 CNC Donor Board

Apple · SKU IP91025 · Fits 1 model

$7.34

per unit
Option
Volume pricing
QuantityUnit priceSaving
$7.34
$6.97−5%
$6.61−10%

Selected SKU IP91025

Shipping weight 0.05 kg

Compatible with 1 model

Match the model number printed on the device (Settings → About, or on the back) before ordering.

Details

The iPhone 13 is one of the most common phones on repair benches, and a share of them arrive with boards too damaged to fix by conventional methods. This CNC-machined donor board for the iPhone 13 lets you rebuild those instead of turning them away.

Order the upper layer without NAND, or a lower layer in a US or EU version. It isn't a complete motherboard.

What it's used for

  • Boards with severe trace and via damage.

  • Phones that failed after a previous repair.

  • Moving chips off a broken board.

  • Recovering data from an iPhone 13 that won't start.

Getting it right

Check the board view and list the parts you'll transfer. Work methodically, one area at a time, and inspect each joint under magnification.

Make sure the lower-layer region matches the phone. Rejoin the board, power it from a bench supply and confirm it boots before reassembly. Test Wi-Fi, cellular, cameras, Face ID and charging one by one, and note each result on the repair ticket. If one function fails, return to the transfer map to see which part handles it, and recheck that area under the microscope before going further.

Specifications

ConditionNew
Part typeCNC donor board (PCB)
Compatible devicesiPhone 13
OptionsUpper layer (without NAND), lower layer US version, lower layer EU version

Questions

Which versions can I order?

Upper layer without NAND, or US or EU lower layer.

Is it a complete board?

No, it's a donor PCB.

Can it help recover data?

Yes, that's one of its uses.

More parts for iPhone 13

All iPhone 13 parts →

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