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Phone Repair Tools & Equipment

Reballing Stencils & Platforms

Reballing stencils and platforms for CPU, NAND and middle-layer (interposer) reballing, plus reballing bars for FPC connectors.
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Buying guide

How to choose a reballing stencil

  • Match the chip. Stencils are made for a chip family (e.g. Kirin, MTK CPU) or a phone model's middle frame layer.

  • Thickness. Common thicknesses such as 0.12 mm define the ball size; use what the chip requires.

  • Platforms. Magnetic reballing bases hold the chip and stencil aligned; dual-sided bases handle CPU and NAND.

  • Use quality solder paste or balls and a heat-resistant mat.

FAQ

What is BGA reballing?

Replacing the solder balls on the underside of a BGA chip after removal, so it can be soldered back onto the board.

What stencil thickness do I need?

It depends on the chip pitch. Many phone CPU stencils are 0.12 mm; follow the stencil listing for the chip.

What is middle-layer reballing?

Stacked iPhone boards are joined by an interposer (middle frame). After separating the boards, the interposer needs to be reballed before reassembly.