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2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

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Tool

2UUL BH17 CPU Reball Base, Magnetic Dual-Sided Set

2UUL · SKU 2U10196

$49.90

per unit
Volume pricing
QuantityUnit priceSaving
$49.90
$47.40−5%
$44.91−10%

Shipping weight 0.3 kg

Details

The 2UUL BH17 is a magnetic, dual-sided reballing base for phone CPUs, sold as a set with stencils for Apple, Samsung, Qualcomm, MediaTek and HiSilicon chips.

Magnets hold the chip and stencil together so they don't slide as you spread paste. The heat-resistant metal base measures 64.5 x 64.5 x 34.5 mm. The listing names 12 iPhone stencils (A10 to A19 Pro), 11 Exynos, 17 Qualcomm, 14 MediaTek and 9 HiSilicon stencils.

When you'd reach for it

  • A CPU removed from a dead phone that must be reballed.

  • A chip with missing or uneven solder balls.

  • Stencils that shift out of line during reflow.

  • A board with a short under the CPU after a drop.

Using a magnetic base

Clean the chip pads flat before mounting. Seat the chip, set the stencil on the magnets, apply paste and reflow evenly with hot air. Let everything cool before lifting the stencil.

Check the stencil list against the chips you see most before ordering. For NAND storage chips, the BH16 is the matching base, built the same magnetic way.

Specifications

Brand2UUL
ModelBH17
ConditionNew
Product typeMagnetic dual-sided CPU reball base set
Base size64.5 x 64.5 x 34.5 mm
StencilsiPhone A10-A19 Pro (12), Exynos (11), Qualcomm (17), MediaTek (14), HiSilicon (9)

Questions

Which iPhone CPUs are covered?

A10 through A19 Pro, 12 stencils.

Is it magnetic?

Yes, magnets hold the chip and stencil.

Does it cover Android CPUs?

Yes: Exynos, Qualcomm, MediaTek and HiSilicon.

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