2UUL PB01 PadBall Solder Balls for iPhone Solder Pad Rework

Picture an iPhone board where a pad lifted while an underfilled chip was coming off. The trace is still there, but the solder ball that used to sit on the pad is gone. Laying a new ball in place and reflowing it is often the quickest way to restore that contact before the chip goes back on.

The 2UUL PB01 PadBall is a pack of tiny solder balls sized for iPhone board pads. According to the listing, the balls are evenly sized and round. It also says they melt smoothly and bond firmly to pads and traces, and that they resist oxidation. The listing doesn't give the ball diameter, alloy or quantity.

When to use them

• Lifted pads after a CPU or baseband chip has been removed.

• Broken or missing pads under connectors.

• Damaged traces near a BGA pad that need a solder contact rebuilt.

• Rework where the original ball is missing.

How to use them

Clean old solder, oxide and dirt from the area. Place the balls one at a time on the prepared pads, then reflow with hot air at a sensible temperature and airflow. Stop as soon as they melt into firm, rounded pads.

Keep the pot sealed, and don't mix these balls with other sizes. For Android boards, 2UUL sells the PB02.