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QUICK TR1300A Rework Station for Phone Motherboard Repair

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Machine

QUICK TR1300A Rework Station

QUICK · SKU SS10009

$409.39

per unit
Volume pricing
QuantityUnit priceSaving
$409.39
$388.92−5%
$368.45−10%

Shipping weight 5.7 kg

Details

Heating a BGA chip unevenly is a quick way to warp a board or lift pads. The QUICK TR1300A is a rework station aimed at BGA and heavier board work, described as giving more uniform heat to reduce thermal stress.

The listing describes powerful heating, precise temperature control and stable heat distribution for IC, SMD and BGA rework, connector and shield removal. It doesn't say whether the TR1300A uses hot air, infrared or a preheater, and gives no wattage or temperature range.

When the TR1300A is meant to help

  • BGA chips with failed or cracked solder balls.

  • Boards that warp under concentrated heat.

  • CPU or NAND removal where pad damage is a risk.

  • Shield removal on heavy multilayer boards.

Questions to ask first

Before buying, check the heating type, power and temperature range with the photos or the manual. A station that heats the board from below works differently from a hot air handle, and your workflow will change accordingly.

Whatever the method, apply flux and let the board cool slowly afterward. Forcing it to cool with a fan right after BGA work can stress fresh joints.

Specifications

BrandQUICK
ModelTR1300A
ConditionNew
Product typeRework station
TemperatureAdjustable (range not stated)

Questions

Is it hot air or infrared?

The listing doesn't say.

Can it do BGA work?

Yes, BGA rework is a listed use.

What's the power rating?

Not stated in the listing.

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