Mijing iRepair MS1 Desoldering Platform with Moulds

Since the iPhone X, Apple has used stacked logic boards, two layers soldered together. Separating and rejoining them without warping either layer is the job the Mijing iRepair MS1 platform is built for.

The platform takes interchangeable moulds that hold the board in place, with support listed for iPhone X, XS, XS Max, 11 Pro and 11 Pro Max, and the iPhone 12 to 16 series. You can buy the platform alone or with the module set, in EU, UK, AU or CN 220 V or US 110 V versions. The package measures 220 x 158 x 50 mm.

Stacked-board faults it helps with

• A phone that is dead after a drop, with cracked joints between layers.

• No-power faults traced to a part sitting between the boards.

• Liquid corrosion trapped in the sandwich.

• Missing or weak signals caused by a broken interposer joint.

Separation basics

Pick the mould for the exact model and seat the board flat. Heat evenly and lift only when the solder has fully melted; forcing it tears pads. Rejoin with fresh paste on the interposer and align it in the same mould.

Buy the platform with modules if you are starting out; get the platform alone if you already own compatible moulds.